Overview of the chip-level repair industry, mobile motherboard architecture, PCB layers, IC types, repair environments, ESD protection, and technician workflow.

Hot air station, soldering iron types, microscope usage, preheater, DC power supply, tweezers, flux types, solder pastes, ESD tools, and safe handling practices.

Understanding multilayer PCBs, SMD components, diodes, capacitors, resistors, coils, mosfets, connectors, fuses, and board-level power & signal pathways.

Using ZXW, Wuxinji, PADS, and schematics, identifying components, tracing nets, understanding lines, voltage rails, and interpreting smartphone motherboard diagrams.

Boot sequence, PMIC functions, dead phone repair, diode mode testing, short-line tracing, current draw recognition, freeze spray techniques, and short isolation.

Charging IC faults, USB port damage, battery connector repair, fast-charging circuits, U2/Tristar IC issues, and fixing charge/no power battery-related faults.

LCD/AMOLED faults, backlight driver IC, touch IC, FPC connectors, no display/no touch issues, reballing display ICs, and restoring broken display lines.

Baseband IC, RF components, antenna switch, network drop issues, Wi-Fi IC faults, IMEI repair basics (legal), signal tracing, and reballing RF chips.

SMD removal/installation, jumper techniques, trace repair, pad restoration, solder wick usage, micro-jumper wiring, and MCU-level microsoldering precision.

BGA workflow, stencil usage, ball placement, reballing process, IC alignment, controlled heating, thermal profiles, and complete BGA chip replacement.

Cleaning processes, ultrasonic cleaning, corrosion removal, replacing damaged components, and restoring water-damaged motherboards.

BIOS/firmware flashing, boot-loop repair, software-assisted hardware diagnosis, EDL mode, test points, and data recovery fundamentals.

Complete chip-level diagnostic project, motherboard repair demonstration, IC rework test, boardview usage exam, and final certification evaluation.